1. 2. 3. material content data sheet sales product name bss306n h6327 issued 29. august 2013 ma# MA000933192 package pg-sot23-3-5 weight* 9.42 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip non noble metal tin 7440-31-5 0.004 0.05 468 noble metal gold 7440-57-5 0.017 0.18 1816 inorganic material silicon 7440-21-3 0.261 2.77 3.00 27707 29991 leadframe non noble metal chromium 7440-47-3 0.009 0.10 960 inorganic material silicon 7440-21-3 0.001 0.01 64 non noble metal titanium 7440-32-6 0.003 0.03 320 non noble metal copper 7440-50-8 3.000 31.86 32.00 318553 319897 wire non noble metal copper 7440-50-8 0.073 0.77 0.77 7722 7722 encapsulation organic material carbon black 1333-86-4 0.056 0.60 5963 plastics epoxy resin - 1.208 12.82 128206 inorganic material silicondioxide 60676-86-0 4.353 46.20 59.62 462137 596306 leadfinish non noble metal tin 7440-31-5 0.150 1.59 1.59 15887 15887 plating noble metal silver 7440-22-4 0.284 3.02 3.02 30197 30197 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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